Custom
Modules
We
have the equipment and facilities required to provide our customers
with state-of-the-art packaging technology for optoelectronic
and microelectronic custom modules including development, proto
series and production capabilities.
Our
facilities fulfil the class 1000 to 10 000 clean room requirements.
We
have professional know-how and equipment for:
-
Semi-automatic epoxy and solder die bonding
-
Semi-automatic wedge and ball wire bonding
-
Welders
for hermetic sealing of metal packages
-
Test
equipment for module testing
In
custom module manufacturing our primary goal is to satisfy our
customers as well as the end users. The best way to fulfil this
is to start the cooperation with the customer as early a stage
of R&D project as possible. We are happy to serve our customers
from prestudy and specification through prototype design and manufacturing
to production. We are very flexible in production and accept tasks
from subcontracting to OEM component manufacturing. We have established
an active network of partners that includes research institutes,
engineering offices, approved part manufacturers etc. to provide
world-class solutions to our customers.
SERVICES
AVAILABLE
-
Module development and design
-
Manufacturing
of prototypes
-
Small
series production
-
Material purchasing and logistic
-
Wire
and die bonding
-
Passive
alignment
-
Hermetic
sealing
-
Conformal
coating
